Thermal Conductivity & CTE

S. No Name of substance Thermal conductivity  w.m-1.k-1  @25°C Coeff. Of Thermal Expansion (CTE)  ppm/k  @25°C Semiconductors 1 GaAs  [see note 1] 55 6.7 2 GaAs (Silicon Doped 5x1018)  [see note 1] 40 3 Germanium  [see note 1] 64 4 InP  [see note 1] 68 4.5 5 Silicon (Pure)  [see note1] 145 4.1 6 Silicon (.0025 ohm-cm)  [See note 1] 98.4 Common Packaging Materials 1 Aluminum (99.9%) 230 23 2 Aluminum (6061) 180 24 3 Aluminum Nitride 170-230 3.5-5.7 4 Aluminum Oxide (96%) 20 6.3-7.4 5 Aluminum Oxide (99.5%) 27 6.7-7.1 6 Beryllia (99.5%) 260 8 7 Copper (99.9%) 393 17 8 Cu/Mo (Copper-15%, Molybdenum-85%) 84 6.6 9 Cu/W (Copper-15%, Tungsten-85%) 230 7.3 10 Diamond (natural) upto 2600 1.2 11 Diamond CVD   1100-1800 1-2 12 Gold (99.9%) 297 14.2 13 Indium 86 29 14 Invar 11 1.3 15 Kovar 16-20 4.6-5.2 16 Molybdenum 140 5.1 17 Silicon carbide  [see note 2] >250 3.7 18 Silicon nitride  [see note 2] > 100 3.2 19 Silver (99.9%) 427 19 20 Heat sync compound (grease with metal oxide) ~ 0.7 21 Silicone grease (Thermally conductive) ~ 0.7 22 Solder(67%Sn/ 33%Pb) 50 25 23 Solder(80%Au/ 20%Sn) 57 16 24 Solder(88%Au/ 12%Ge) 44 13 Other Materials 1 Brass (70-30)  [see note3] 70 20 2 Bronze (SAE-64)  [see note3] 47 18 3 Chromium 69 6.2 4 Iron Pure 80 12 5 Mild Steel   [see note 3] 61 15 6 High Carbon Steel (1%) AISI type 1095  [see note 3] 50 11 7 Stainless Steel (303)   [see note 3] 16.4 17.2 8 Lead 35 28 9 Magnesium 156 27 10 Mercury 8 182 11 Nichrome  [see note 3] 13 15 12 Platinum 71 9 13 Tin 67 23 14 Titanium 17 10 15 Tungsten 170 4.5 16 Uranium 27 10.5 17 PTFE 0.25 100 18 PVC 0.16-0.20 100-250 19 Quartz 8 0.5 20 Glass Soda Lime, Plate Glass 0.93 8.7 21 Concrete ~1 1.3 22 Wood [see note 4] 0.04-0.30 3-60 23 Water 0.6 24 Air at 0'C 0.025 Notes:  1) For all semiconductors thermal conductivity varies with doping.  2) Most recent data.  3) Thermal conductivity for most alloys vary significantly depending upon the composition; Values given are for a particular composition.  4)CTE of wood is anisotropic.